- Производитель:
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- Cooling Source (4)
- CUI Devices (3)
- Malico Inc. (2)
- Wakefield-Vette (23)
- Material:
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- Attachment Method:
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- Package Cooled:
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- Fin Height:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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